Questions tagged [high-speed]
High-speed design deals with designing circuits which are working at high frequencies where side-effects like path inductance gain significant influence.
396 questions
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Gigabit Ethernet: capacitor isolation (1st device) - transformer isoaltion (2nd device) will it work?
I am designing an adapter board for a camera which is an original device with Gigabit Ethernet interface.
The previous version of the adapter board was using LAN7500 and transformer as a USB dongle ...
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Why impedance matching for only certain signals and not for other signals
I have a question.
Usually, in normal communication interfaces such as I2C, SPI or even normal GPIO interfaces, we don't associate them with impedance matching.
But for certain signals (I don't know ...
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Can you route multiple returns to the same via?
New to PCB Design and layout. While routing bypass caps, I instinctively give each bypass cap its own via to the ground plane. What would be the disadvantages of having two (or more) bypass caps share ...
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Will supplying four ESCs affect the signal integrity of a separate controller board
I'm designing a drone controller board and a power distribution board. The power distribution board will supply the controller board, and up to 4 (Electronic Speed Controllers)ESCs, from a 4S-6S LiPo ...
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What's happening to my stepper motor at high RPM?
I am trying to get high RPM output from my stepper motor, but no matter what I try I can't get it to spin more than 65,000 steps/sec.
I have tried many combinations of settings, drivers, power supply, ...
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SPI (15 MHz Signal) on two Layer PCB
I want to do a MIDI Controller which uses 15 MHz SPI between a Teensy 3.6 and 74HC595 / 74HC165 Shift Registers to read a button Matrix. The code is finished and the PCB would be the next step. I have ...
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DDR4 clock termination
In many places I have seen that an AC termination scheme is recommended for high speed clock termination. What is the reason for choosing this scheme?
For AC termination, can a capacitor be connected ...
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Voltage translator max frequency?
I know this question depends on the component but let's take this one for example : https://www.nexperia.com/products/analog-logic-ics/asynchronous-interface-logic/voltage-translators-level-shifters/...
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Differential pair on a PCB region without a reference plane
I was reading the datasheet for an Ethernet interface layout from NXP and I found they didn't use a reference plane in the region where they routed the differential pairs. I couldn't understand why ...
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Where has my bandwidth gone?
A continuation of this project, that I hoped would be done and working by now.
The problem this time appears to be that the circuit is too slow. The desaturation/grayscale and attenuation seem to ...
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Placement of components on PCB
I have a four layered PCB with two major high frequency component placed on the top layer. One is JN5169 and other is SE2431l (front end module), both operate in GHz. While evaluating the circuit (...
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Why route signals orthogonally in adjacent layers?
I am investigating PCB stack-up. Everywhere I have seen it says to route signals on adjacent layers orthogonally to reduce the coupling. I have two questions:
How does orthogonal routing reduces the ...
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Why is programmed I/O not suitable for high-speed data transfer?
I am learning about computer architecture and organization.
I have read that programmed I/O is not suitable for high-speed data transfer because it does not support synchronous mode of data ...
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Controlled Impedance Trace-reference plane Placement
I am new to high-speed PCB design. I was studying controlled impedance traces from the internet with the help of various documents.
Everywhere it says controlled impedance traces need a reference ...
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Cable Issues with USB HS
We’re working on a product that makes use of USB HS, and are having some connection and consistency issues.
Originally, our product was USB FS-based and we had no connectivity issues; with this second ...
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Migrating from USB 3.0 Micro B to Type B connector
The current design uses a Micro B connector for the USB 3.0 connectivity. Unfortunately, this connector is susceptible to mechanical stress if the PCB is not handle with care, which results in ripped ...
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Do all SDRAM applications require high-speed routing?
I am a chemistry student and I am beginning to realize that I have fallen into a EE rabbit hole..
I am trying to create a PCB (digital audio delay unit) from a schematic which includes a SDRAM, this ...
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Twisted Pair input routing on PCB
I have a twisted pair input to the IN+ and IN- pins of the MAX9278 deserializers.
The Parallel data output of the deserializer consists of 4 LVDS data channels and 1 LVDS Clock channel to a 3.1" ...
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Differential pair length matching considering phase
According to Microchip's document Implementation Guidelines for Microchip’s USB 2.0 and USB 3.1 Gen 1 and Gen 2 Hub and Hub-Combo Devices, the Superspeed differential pairs should be length matched ...
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High voltage amplification of a waveform generator output
I need to drive an ultrasonic transducer with a high center frequency (25 MHz) using my function generator that outputs a 25 MHz sine wave at only 5 Vpp. The problem is that the transducer needs at ...
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Highspeed Signals on outer layers of pcb
in many application notes for processors in a BGA package I see a declaration that you could fully fanout the bga using only 4-6 layers and almost no HDI technology like microvias, burried vias even ...
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Why USB 2.0, USB 3.0, PCI signals must be routed in 85E differential ohm impedance and not 100E impedance?
USB 3.0 and USB 2.0, pci signals, Why its always recommended to route at 85E impedance and not 100E impedance?
Below are the signals to be routed at 85E
D− (USB 2.0 differential pair)
D+ (USB 2.0 ...
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Overshoot and undershoot on clock signal missing in high frequency(HyperLynx)
I'm using it for my work in Hyperlynx SI to test high-speed signals.
This is a general question but I read somewhere that the simulation in high freq could make a problem to identify some peaks in ...
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Selecting a SerDes IC based on format
I have a query regarding selection of SerDes ICs. I need to select an IC which is compatible with 3 formats - 24bits, 32bits and 27bits.
MAX9275 - Just a sample IC datasheet in the MAX SerDes GMSL ...
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Routing USB 3.x Type-C Signals
I'm designing an open source USB Type-C Switch (KVM Style), and I started to route the USB 3.x SuperSpeed+ and USB 2.x HighSpeed differential signal pairs on the PCB.
The switch will have 2 input + 1 ...
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Is the spacing between Ethernet 10/100 Mbps and USB 2.0 traces critical?
I am designing a board with USB 2.0 and Ethernet 10/100Mbps. I found this layout guide with very helpful information.
In the layout guide, at p. 34 (Table 7), it says that the minimum spacing between ...
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Are specific impedances for high-speed signals maintained beyond the PCB connectors?
I found this article that describes the specific impedances that single/differential traces must have for high speed signals (using microstrips).
But what happens to these impedances beyond the ...
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Should dielectric constant be high or low for high-speed design? And why?
I'm very confused that dielectric constant should be selected high or low to design high-speed boards.
It can be compared with FR4 material, dc ~4,6.
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Locally hatched ground plane to increase differential impedance
I am designing a flexible PCB to carry two types of differential signals. One is about 1.2Gbps 100R differential impedance, while the other is only 3Mbps, with much more tolerance on the impedance.
...
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Rise time of 6N136 opto-coupler
I am trying to use below circuit for convert 24VDC high speed pulse to 5VDC pulse that can interface to a stepper driver IC.
I have used 6N136 opto-coupler and according to its datasheet it can handle ...
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Strange behavior of high gain amplifier using AD8000, high speed op amp
I'm designing a PCB circuit for an amplifier to amplify a pulse with a rising time of 1 ns about 100 times.
I decided to use the Analog Device AD8000 as op-amps.
This is the schematic of one amplifier....
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High-speed IC GND next to oscillator GND
I am designing a board, 4 layer with a ground plane. In my current layout, the ground VIA of an oscillator IC is very close in proximity with the ground VIA of a high speed IC. Is there a chance that ...
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Resistors in high-speed I/O trace when impendance mismatching
I am little bit confused over impedance matching when dealing with high-speed digital I/Os. I would like to share some perspectives in hope to clarify a few things.
Let's consider a digital output ...
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How to deal with simulation/measurement discrepancies of simple RF circuits (e.g. matching) without access to expensive equipment?
Designing a circuit (PCB) operating at low frequencies is fairly straight forward. However, my design includes a simple RF frontend. The frontend consists of usual componenents on a PCB (SMA connector,...
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Ethernet 1Gbps - PCB stackup
I am planning a stackup for 2x Ethernet phys. The chip requires a few different supply voltage levels: I/O Power 3V3 (3 pins) and Analog Supplies: VDD2V5 (2 pins) and VDD1V0 (4 pins). Each pin has ...
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Thin film capacitor for voltage multiplier
I am designing a voltage multiplier with 5 to 10 stages. I have this circuit where I run a transformer at 450KHz and feed the output to the voltage multiplier. Is it a good idea to use thin film ...
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Why DDR4 Specs recommend that Address, Control and Clock buses be referenced to VDD?
Micron's Technical Note TN-40-40: DDR4 Point-to-Point Design Guide, page 19, says (emphasis mine):
Timing Budget
Suggested practice is to look at the design from a timing budget
standpoint to provide ...
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How can a SerDes based link be used to replace the age old UART? [closed]
UART is great to transmit log data from a DUT to a PC. However, it is not fast enough. There are many newer things like USB, PCIe e.t.c that can transfer a lot more data and also use serial transfer. ...
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Parallel trace signal integrity: Increasing width to match characteristic impedance vs increasing trace gap
Imagine you are routing a large number of single ended high speed traces through a long narrow gap on a PCB. Lets say these are ultra-high speed SD signals, so a 208MHz clock. The traces should be ...
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Is this differential pair routing OK?
I am working on a PCB layout on a very space constrained, 4-layer board. On the board is a MIPI-output image sensor (1 lane) which go to an FPGA.
Layer 1: Image sensor
Layer 2: Full Gnd plane
Layer 3: ...
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DDR3 pcb design routing
I am trying to layout DDR3 128MB chip and a Spartan-6 FPGA. DDR signal pins located on specific memory controller pins and could not be swapped.
I've never done DDR routing and went with SP605 Xilinx ...
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JLC2313 stackup with DDR3 fly-by
I’m building a simple SBC based on Allwinner A33 for my undergraduate final project, includes two x8 DDR3 chips. I’m going with 6 layers JLC2313 Stackup 1.2mm thickness (cost reasons). It’s my first ...
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Why is an attenuator placed on the scope end and not the PCB end?
I've noticed when adding an external attenuator between PCB and the scope (1MOhm) that it is placed in this manner:
PCB -> SMA Socket -> SMA Cable Plug -> SMA Attenuator -> SMA-to-BNC -> Scope
Why ...
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4 Layer PCB Altium - 2nd Layer Ground, others Thermal
I read since a long time but never had an account, now its my turn to ask a question on here:
I have an idea but currently unsure if that works technically or if it is good design:
1st (Top Layer) : ...
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Interfacing many camera modules using a single DVP bus
I need to create a circuit that will have many cameras. Possibly the OVM7692. I will connect this array to my host processor via DVP.
The cameras are controlled via SCCB which seems to be a name that ...
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When to Remove the Ground Plane under SMD components for High-Speed Signals?
I'm reading TI's recommendations on routing high-speed signals. Most of the guidelines are common sense, but there's one guideline that I haven't read before: It recommends completely removing the ...
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Thermal reliefs for via-in-pad under BGA?
I'm doing the layout of a high-speed (Multi gigabit) system based on an FPGA with more than a thousand BGA pads and 0.8mm pitch on a 10-layer board. I'm using via in pads that will be copper-filled ...
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PCB simulation of high speed ADC daughter card connected via FMC connector
A design using high speed ADC is to be carried out involving an FPGA as the master device. To simplify the prototype phase, a daughter board with the ADC shall be designed and connected to the FPGA ...
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Detecting activity on LVDS line
For some test equipment I have an LVDS line running at 100 Mbps. I would like to make an Arduino Due (because I use this for other monitoring in the test) detect activity on the LVDS line.
Using a (...
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Are FPGA Mezzanine Card (FMC) interfaces supposed to be compatible across different FPGA boards?
The FPGA Mezzanine Card is a connector intended for use with daughter boards that have high frequency components. Thus, if one was to use a 100MHz+ daughter board, it would require use of either FPGA ...